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3D multiple sound source localization by proposed cuboids nested microphone array in combination with adaptive wavelet-based subband GEVD
| dc.contributor.author | Dehghan Firoozabadi, Ali | |
| dc.contributor.author | Irarrazaval, Pablo | |
| dc.contributor.author | Adasme, Pablo | |
| dc.contributor.author | Zabala-Blanco, David | |
| dc.contributor.author | Palacios Játiva, Pablo | |
| dc.contributor.author | Azurdia-Meza, Cesar A. | |
| dc.date.accessioned | 2023-04-18T14:57:30Z | |
| dc.date.available | 2023-04-18T14:57:30Z | |
| dc.date.issued | 2020 | |
| dc.identifier.uri | http://repositorio.ucm.cl/handle/ucm/4688 | |
| dc.description.abstract | Sound source localization is one of the applicable areas in speech signal processing. The main challenge appears when the aim is a simultaneous multiple sound source localization from overlapped speech signals with an unknown number of speakers. Therefore, a method able to estimate the number of speakers, along with the speaker’s location, and with high accuracy is required in real-time conditions. The spatial aliasing is an undesirable effect of the use of microphone arrays, which decreases the accuracy of localization algorithms in noisy and reverberant conditions. In this article, a cuboids nested microphone array (CuNMA) is first proposed for eliminating the spatial aliasing. The CuNMA is designed to receive the speech signal of all speakers in different directions. In addition, the inter-microphone distance is adjusted for considering enough microphone pairs for each subarray, which prepares appropriate information for 3D sound source localization. Subsequently, a speech spectral estimation method is considered for evaluating the speech spectrum components. The suitable spectrum components are selected and the undesirable components are denied in the localization process. The speech information is different in frequency bands. Therefore, the adaptive wavelet transform is used for subband processing in the proposed algorithm. The generalized eigenvalue decomposition (GEVD) method is implemented in sub-bands on all nested microphone pairs, and the probability density function (PDF) is calculated for estimating the direction of arrival (DOA) in different sub-bands and continuing frames. The proper PDFs are selected by thresholding on the standard deviation (SD) of the estimated DOAs and the rest are eliminated. This process is repeated on time frames to extract the best DOAs. Finally, K-means clustering and silhouette criteria are considered for DOAs classification in order to estimate the number of clusters (speakers) and the related DOAs. All DOAs in each cluster are intersected for estimating the position of the 3D speakers. The closest point to all DOA planes is selected as a speaker position. The proposed method is compared with a hierarchical grid (HiGRID), perpendicular cross-spectra fusion (PCSF), time-frequency wise spatial spectrum clustering (TF-wise SSC), and spectral source model-deep neural network (SSM-DNN) algorithms based on the accuracy and computational complexity of real and simulated data in noisy and reverberant conditions. The results show the superiority of the proposed method in comparison with other previous works. | es_CL |
| dc.language.iso | en | es_CL |
| dc.rights | Atribución-NoComercial-SinDerivadas 3.0 Chile | * |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/cl/ | * |
| dc.source | Electronics, 9(5), 867 | es_CL |
| dc.subject | Sound source localization | es_CL |
| dc.subject | Nested microphone array | es_CL |
| dc.subject | Spectral estimation | es_CL |
| dc.subject | Wavelet transform | es_CL |
| dc.subject | Subband processing | es_CL |
| dc.subject | Clustering | es_CL |
| dc.title | 3D multiple sound source localization by proposed cuboids nested microphone array in combination with adaptive wavelet-based subband GEVD | es_CL |
| dc.type | Article | es_CL |
| dc.ucm.facultad | Facultad de Ciencias de la Ingeniería | es_CL |
| dc.ucm.indexacion | Scopus | es_CL |
| dc.ucm.indexacion | Isi | es_CL |
| dc.ucm.uri | www.mdpi.com/2079-9292/9/5/867 | es_CL |
| dc.ucm.doi | doi.org/10.3390/electronics9050867 | es_CL |
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